Surface mount chip capacitor

Metal working – Barrier layer or semiconductor device making – Barrier layer device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S381000

Reexamination Certificate

active

11266632

ABSTRACT:
The surface mount chip capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount chip capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount chip capacitor of the present invention is created by methods which include the steps of forming a wire and placing conductive powder upon the wire. An embodiment of the present invention, presses the wire from a foil sheet and electrophoretically depositing the conductive powder element upon the wire.

REFERENCES:
patent: 3679944 (1972-07-01), Yoshimura et al.
patent: 3828227 (1974-08-01), Millard et al.
patent: 4009424 (1977-02-01), Itoh
patent: 4090288 (1978-05-01), Thompson et al.
patent: 4494299 (1985-01-01), Franklin et al.
patent: 4984130 (1991-01-01), Düll et al.
patent: 5036434 (1991-07-01), Kobayashi
patent: 5117333 (1992-05-01), Kakuma et al.
patent: 5168434 (1992-12-01), Kobayashi
patent: 5349496 (1994-09-01), Taniguchi et al.
patent: 5390074 (1995-02-01), Hasegawa et al.
patent: 5699597 (1997-12-01), Nakamura et al.
patent: 6212064 (2001-04-01), Aoki et al.
patent: 6238444 (2001-05-01), Cadwallader
patent: 6380577 (2002-04-01), Cadwallader
patent: 6410083 (2002-06-01), Pozdeev-Freeman
patent: 6504705 (2003-01-01), Shimada et al.
patent: 6510043 (2003-01-01), Shiue et al.
patent: 6541302 (2003-04-01), Huber et al.
patent: 6679934 (2004-01-01), Rao et al.
patent: 7144432 (2006-12-01), Nakamura
patent: 2003/0174461 (2003-09-01), Takatani et al.
patent: 2004/0195093 (2004-10-01), Cohen et al.
patent: WO 02/103728 (2002-12-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Surface mount chip capacitor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface mount chip capacitor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface mount chip capacitor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3859266

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.