Surface mount attachments of daughterboards to motherboards

Details Surface mount attachments of daughterboards to motherboards Surface mount attachments of daughterboards to motherboards

1995-07-28

1997-08-12

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361803, 361784, 361779, 439 91, H05K 114

Patent

active

056572085

ABSTRACT:
A hybrid printed circuit board comprising two substrates having different thermal coefficients of expansion can be manufactured using automated surface mount techniques. A daughterboard is configured with a number of contact pads on the bottom. A motherboard is configured with an aligned set of contact pads on the top with solder compound stenciled on them. The daughterboard is attached to the motherboard using standard automated surface mount techniques.

REFERENCES:
patent: 5477933 (1995-12-01), Nguyen
patent: 5572405 (1996-11-01), Wilson et al.

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