Surface modified encapsulated inorganic resist

Details Surface modified encapsulated inorganic resist Surface modified encapsulated inorganic resist

2005-07-05

2005-07-05

Chu, John S. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

C430S192000, C430S193000, C430S270100, C430S313000, C430S314000, C430S324000, C430S326000

Reexamination Certificate

active

06913865

ABSTRACT:
The present invention describes encapsulated inorganic resists which are compatible with conventional resist processing and development. The encapsulated inorganic materials increase the plasma etch selectivity of the resists compared to conventional polymeric resists. In effect, these resist systems can act as photoimagable single layer hard mask. In a preferred embodiment, the encapsulated material includes inorganic core particles that are at least partially coated with a moiety having an acid labile or photo-labile protected acidic group such that, upon deprotection, the encapsulated material exhibits greater base solubility.

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