Surface modified copper alloys

Metal treatment – Stock – Copper base

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Details

148206, 148238, 148240, 428615, 428627, 428674, C22C 900

Patent

active

053206894

ABSTRACT:
There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.

REFERENCES:
patent: 4043839 (1977-08-01), Hartline, III et al.
patent: 4094671 (1978-06-01), Hayashi
patent: 4352698 (1982-10-01), Hartley et al.
patent: 4412899 (1983-11-01), Beale
patent: 4436560 (1984-03-01), Fujita et al.
patent: 4451302 (1984-05-01), Prescott et al.
patent: 4500605 (1985-02-01), Fister et al.
patent: 4643859 (1987-02-01), Mitomo et al.
patent: 4656499 (1987-04-01), Butt
patent: 4692191 (1987-09-01), Maeda et al.
patent: 4693760 (1987-09-01), Sioshansi
patent: 4707416 (1987-11-01), Ebata et al.
patent: 4756791 (1988-07-01), D'Angelo et al.
patent: 4784974 (1988-11-01), Butt
patent: 4799973 (1989-01-01), Mahulikar et al.
patent: 4961457 (1990-10-01), Watson et al.
patent: 5104748 (1992-04-01), Mori et al.
Metallurgical Transactions A, vol. 15A, Dec. 1984 entitled "The Wear Behavior of Nitrogen-Implemented Metals" by W. C. Oliver; R. Hutchings and J. B. Pethica, pp. 2221-2229.
The MIT Press, Cambridge, Mass., "Ion Implantation Coatings" by M. T. Clapp and L. E. Rehn, pp. 2412-2415.
Computer search Report, Aug. 1992, US-PTO, L1-L9; see L1, L3 and L8.
"Formation of TiN-encapsulated Copper Structures in a NH3 Ambient" appearing 1992 American Institute of Physics, Appl. Phycs. Lett. 60(24) Jun. 15, 1992 at pp. 2983-2985.
"On the Formation of Fe-Carbides in Cu-Fe and Cu-Au-Fe Alloys" Scripta Metalurgica, vol. 17, pp. 463-466, 1983, Copyright Pergamon Press Ltd.

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