Metal treatment – Stock – Copper base
Patent
1993-03-01
1994-06-14
Roy, Upendra
Metal treatment
Stock
Copper base
148206, 148238, 148240, 428615, 428627, 428674, C22C 900
Patent
active
053206894
ABSTRACT:
There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.
REFERENCES:
patent: 4043839 (1977-08-01), Hartline, III et al.
patent: 4094671 (1978-06-01), Hayashi
patent: 4352698 (1982-10-01), Hartley et al.
patent: 4412899 (1983-11-01), Beale
patent: 4436560 (1984-03-01), Fujita et al.
patent: 4451302 (1984-05-01), Prescott et al.
patent: 4500605 (1985-02-01), Fister et al.
patent: 4643859 (1987-02-01), Mitomo et al.
patent: 4656499 (1987-04-01), Butt
patent: 4692191 (1987-09-01), Maeda et al.
patent: 4693760 (1987-09-01), Sioshansi
patent: 4707416 (1987-11-01), Ebata et al.
patent: 4756791 (1988-07-01), D'Angelo et al.
patent: 4784974 (1988-11-01), Butt
patent: 4799973 (1989-01-01), Mahulikar et al.
patent: 4961457 (1990-10-01), Watson et al.
patent: 5104748 (1992-04-01), Mori et al.
Metallurgical Transactions A, vol. 15A, Dec. 1984 entitled "The Wear Behavior of Nitrogen-Implemented Metals" by W. C. Oliver; R. Hutchings and J. B. Pethica, pp. 2221-2229.
The MIT Press, Cambridge, Mass., "Ion Implantation Coatings" by M. T. Clapp and L. E. Rehn, pp. 2412-2415.
Computer search Report, Aug. 1992, US-PTO, L1-L9; see L1, L3 and L8.
"Formation of TiN-encapsulated Copper Structures in a NH3 Ambient" appearing 1992 American Institute of Physics, Appl. Phycs. Lett. 60(24) Jun. 15, 1992 at pp. 2983-2985.
"On the Formation of Fe-Carbides in Cu-Fe and Cu-Au-Fe Alloys" Scripta Metalurgica, vol. 17, pp. 463-466, 1983, Copyright Pergamon Press Ltd.
Mahulikar Deepak
Mravic Brian
Olin Corporation
Rosenblatt Gregory S.
Roy Upendra
LandOfFree
Surface modified copper alloys does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Surface modified copper alloys, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface modified copper alloys will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1246104