Surface modification of organic materials to improve adhesion

Details Surface modification of organic materials to improve adhesion Surface modification of organic materials to improve adhesion

1991-05-16

1993-05-04

Hearn, Brian E.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427123, 427307, 427322, 156657, 156653, 156668, 156643, 156646, H01L 2100

Patent

active

052080676

ABSTRACT:
A silicon modified organic surface is roughened by treatment with an oxygen containing plasma. If necessary the organic surface may be silicon-modified by treatment with a silicon containing material prior to plasma treatment. The roughened organic surface provides improved adhesion to other organic surfaces and to deposited metals. Improvements in methods for laminating organic surfaces and for depositing metals on organic surfaces which achieve improved adhesion are disclosed. Structures comprising laminated organic layers or metal deposited on organic surfaces which provide improved adhesion between the organic layers or between the metal and the organic-surface are also disclosed.

REFERENCES:
patent: 4137365 (1979-01-01), Wydeven et al.
patent: 4493855 (1985-01-01), Sachdev et al.
patent: 4599243 (1986-07-01), Sachdev et al.
"Plasma Polymer Surface Adhession Modification Method"; Nguyen et al., IBM Tech, Disclosure Bulletin; vol. 27, No. 6, Nov. 1984, pp. 3273-3274.
"Polymer Interlayer Adhession Enhancements Through Plasma Surface Modification"; Wheater et al., E.C.S. Meeting; Oct. 1983.

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