Surface micromachined differential microphone

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S025410, C029S592100, C029S609100, C381S113000, C381S114000, C381S171000, C381S173000, C381S174000

Reexamination Certificate

active

07992283

ABSTRACT:
A differential microphone having a perimeter slit formed around the microphone diaphragm that replaces the backside hole previously required in conventional silicon, micromachined microphones. The differential microphone is formed using silicon fabrication techniques applied only to a single, front face of a silicon wafer. The backside holes of prior art microphones typically require that a secondary machining operation be performed on the rear surface of the silicon wafer during fabrication. This secondary operation adds complexity and cost to the micromachined microphones so fabricated. Comb fingers forming a portion of a capacitive arrangement may be fabricated as part of the differential microphone diaphragm.

REFERENCES:
patent: 4849071 (1989-07-01), Evans et al.
patent: 5490220 (1996-02-01), Loeppert
patent: 5573679 (1996-11-01), Mitchell et al.
patent: 6788796 (2004-09-01), Miles et al.
patent: 7329933 (2008-02-01), Zhe et al.
patent: 2007/0297631 (2007-12-01), Miles et al.
patent: WO 2004/016041 (2004-02-01), None
Office Action for German Application No. 11 2007 000 263.8-54 dated Sep. 15, 2010.
U.S. Appl. No. 10/689,189, filed Oct. 2003, Miles et al.

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