Surface micro sensor and method

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Distributive type parameters

Reexamination Certificate

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C324S071100, C324S693000

Reexamination Certificate

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07489141

ABSTRACT:
The present invention provides a micro sensor for monitoring the cleaning and drying processes of surfaces of dielectric films, micro features in porous dielectric films and biologic or other cells common in microelectronics fabrication, MEMS fabrication or microbiology test system fabrication. By embedding electrodes in the surface of a supporting dielectric, the sensor can probe the surface and pores of a covering dielectric or a cell on the covering dielectric. The addition of a guard reduces the effects of any parasitic capacitance, which extends the measurement bandwidth of the sensor and allows it to be manufactured at the scale of a single cell, a feature that is particularly important for applications in microbiology.

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K. Romero et al “In-situ analysis of wafer surface and deep trench rinse,” Cleaning Technology in Semiconductor Device Manufacturing VI, The Electrochemical Society, 2000.
A.D. Hebda et al, “Fundamentals of UPW rinse: analysis of chemical removal from flat and patterned wafer surfaces” Cleaning Technology in Semiconductor Device Manaufacturing VI, The Electrochemical Society, 2000.
J. Yan et al. “Test Structures for Analyzing Mechanisms of Wafer Chemical Contaminant Removal”, IEEE International Conference on Microelectronic Test Structures, pp. 209-213, Mar. 2003.

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