Surface metallized semiconductors

Stock material or miscellaneous articles – Composite – Of silicon containing

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427 92, 4274431, 428457, 428470, B32B 1504, B05D 512

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active

045420742

ABSTRACT:
The firmly adhesive metallization, in particular partial metallization, of the surface of semiconductors is possible, without pickling, by carrying out the activation with organometallic compounds of metals of the I and VIII Secondary Groups of the Periodic Table of Elements, then reducing in a conventional manner and metallization without current.

REFERENCES:
patent: 3523038 (1970-08-01), Sanders
patent: 3890455 (1975-06-01), Ballas et al.
patent: 4359487 (1982-11-01), Schneider

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