Surface melting of a substrate prior to plating

Details Surface melting of a substrate prior to plating Surface melting of a substrate prior to plating

1980-09-12

1982-09-07

Gantz, Delbert E.

Chemistry: electrical and wave energy

Processes and products

200267, 204 37R, 204192C, 219121EG, 219121LF, 219121LM, 339278C, 427 35, 427 531, 427319, 427250, C25D 534, H01H 102

Patent

active

043482635

ABSTRACT:
Substrates for use in electrical contacts are prepared prior to plating by rapid surface melting by means of a laser beam or an electron beam. Improved microscopic surface characteristics are obtained. In a preferred embodiment, improved macroscopic surface roughness characteristics are also obtained by shorter-duration melting, typically by means of a pulsed YAG laser. Gold which has been electroplated onto copper alloys prepared by this technique has shown improved resistance to sulfur and chlorine corrosive atmospheres. This allows, for example, a thinner layer of a protective metal to be used to obtain a given degree of protection.

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