Surface machining method and apparatus

Details Surface machining method and apparatus Surface machining method and apparatus

1996-12-03

1998-08-11

Rose, Robert A.

Abrading

Machine

Rotary tool

451 41, 451 60, 451 63, 451271, 451291, 451 38, B24B 501

Patent

active

057919763

ABSTRACT:
A wafer is rotated on its axis, which is biased with regard to an axis of a grinding wheel, and revolves around an axis which is biased with regard to the axis of the wafer and the axis of the grinding wheel. In this state, the grinding wheel is abutted against the surface of the wafer. Thus, all abrasive grains on the grinding wheel can act on the whole surface of the wafer.

REFERENCES:
patent: 4211041 (1980-07-01), Sakulevich et al.
patent: 4615145 (1986-10-01), Matsumoto et al.
patent: 4726150 (1988-02-01), Nishio et al.
patent: 4916868 (1990-04-01), Wittstock
patent: 4979334 (1990-12-01), Takahashi
patent: 5516328 (1996-05-01), Kawada

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