Surface layer structure of an ink transfer device

Coating apparatus – Solid applicator contacting work – Pads or absorbent or porous applicators

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

101333, 118265, 118268, 401196, 401198, 428212, 428213, 428215, 428218, 4283155, 4283157, 4283159, 4283166, 4283213, 428327, 428909, 428914, B32B 326, B41K 150, B41K 152, B41K 154

Patent

active

043367674

ABSTRACT:
An ink transfer device comprising an ink transfer surface layer which may be connected to a porous ink storage body, such as used in a printing device or apparatus, having a porous structure with continuous pores therein and 8 to 30% porosity, and a surface ruggedness of less than 20 microns and ink mobilizable and storable porous ink storage body. The structure of the ink transfer surface layer and the ink storage body are produced respectively and successively by heat compression in a mold, thermoplastic powder of less than 50 microns diameter and of a little larger than the former ones. The inventive ink transfer surface layer enables uniform and efficient transfer of ink from the device even after repeated impressions of the device.

REFERENCES:
patent: 2526311 (1943-09-01), Wilson
patent: 3413184 (1968-11-01), Findlay et al.
patent: 3442681 (1969-05-01), Newman et al.
patent: 3617328 (1971-11-01), Newman
patent: 3628979 (1971-12-01), Newman et al.
patent: 3681186 (1972-08-01), Findlay et al.
patent: 3971315 (1976-07-01), Hansen

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Surface layer structure of an ink transfer device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface layer structure of an ink transfer device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface layer structure of an ink transfer device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2161257

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.