Surface grinding method and apparatus

Details Surface grinding method and apparatus Surface grinding method and apparatus

1997-01-17

1998-10-06

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451 5, 451 6, 451 9, 451 10, 451 11, 451288, 451380, B24B 100

Patent

active

058168958

ABSTRACT:
A semiconductor wafer is placed on a table, and a grinding wheel grinds the surface of the semiconductor wafer. Non-contact sensors are arranged above the semiconductor wafer to detect the thickness of the semiconductor wafer during grinding. Each piece of information relating to the thickness is output to a CPU. Piezoelectric devices are arranged at regular intervals between a flange, which is secured to a grinding wheel spindle, and a frame 40. Voltages applied to the piezoelectric devices are controlled by a piezoelectric device controller which is controlled by the CPU. When the piezoelectric devices are driven, the attitude of the grinding wheel spindle is controlled in such a manner as to be rocked with regard to the table. If the CPU calculates the detected values of the sensors during the grinding, the direction and magnitude of inclination of the table and the grinding wheel spindle can be found. Then, the attitude of the grinding wheel spindle is controlled, so that the surface of the semiconductor wafer can be ground to be flat.

REFERENCES:
patent: 5054244 (1991-10-01), Takamatsu et al.
patent: 5433650 (1995-07-01), Winebarger
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5567199 (1996-10-01), Huber et al.
patent: 5618447 (1997-04-01), Sandju
patent: 5658183 (1997-08-01), Sandhu et al.

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