Semiconductor device manufacturing: process – Manufacture of electrical device controlled printhead
Reexamination Certificate
2011-01-04
2011-01-04
Lindsay, Jr., Walter L (Department: 2812)
Semiconductor device manufacturing: process
Manufacture of electrical device controlled printhead
C438S029000, C257SE21002
Reexamination Certificate
active
07863061
ABSTRACT:
Provided is a surface emitting laser manufacturing method, etc., which reduces process damage occurring to a surface relief structure, enabling stable provision of a single transverse mode characteristic. Provided is a method including a surface relief structure for controlling a reflectance in a light emitting portion of an upper mirror, the surface relief structure including a stepped structure, includes: forming a resist pattern including a pattern for forming a mesa structure and a pattern for forming a stepped structure, on or above the upper mirror, and performing first-phase etching for etching the surface layer of the upper mirror to determine the horizontal position of the stepped structure; forming a current confining structure after the performing first-phase etching; and performing second-phase etching for further etching the area that the first-phase etching has been performed, to determine the depth position of the stepped structure, after the forming a current confining structure.
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Ikuta Mitsuhiro
Inao Yasuhisa
Yamaguchi Takako
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
Lindsay, Jr. Walter L
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