Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-01-04
2008-11-18
Dang, Phuc T (Department: 2892)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S022000, C257S088000, C362S227000
Reexamination Certificate
active
07452736
ABSTRACT:
There are provided a surface emitting device and a projection display device, in which high power output can be produced by configuring a large-scaled LED. The surface emitting device includes a plurality of stacked light emitting elements provided on one module. Each of the stacked light emitting elements includes n-type layers, light emitting layers and p-type layers, which are formed in sequence.
REFERENCES:
patent: 6939731 (2005-09-01), Ishizaki
patent: 7274040 (2007-09-01), Sun
Dang Phuc T
Lee Hong Degerman Kang & Waimey
LG Electronics Inc.
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