Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-11-05
1998-08-04
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257720, 361709, H05K 720
Patent
active
057903794
ABSTRACT:
A natural heat dissipation device for a microprocessor. The microprocessor is conventionally mounted to a printed circuit board. The printed circuit board contains a recess that is cut-out directly below the microprocessor. Heat sink material is attached to the microprocessor through the recess. The heat sink material attached to the bottom of the microprocessor may be used alone or in conjunction with a an attached metal tray or case under the printed circuit board.
REFERENCES:
patent: 4509096 (1985-04-01), Baldwin
patent: 5019940 (1991-05-01), Clemens
patent: 5045921 (1991-09-01), Lin
patent: 5272599 (1993-12-01), Koenen
patent: 5311060 (1994-05-01), Rostoker
patent: 5329426 (1994-07-01), Villani
patent: 5331507 (1994-07-01), Kyung
patent: 5384940 (1995-01-01), Soule
patent: 5386339 (1995-01-01), Polinski, Jr.
patent: 5434105 (1995-07-01), Liou
patent: 5533256 (1996-07-01), Call
"Water Cooling Plate --Packages", Archey, IBM Tech Discl Bull vol. 10 No. 2 Jul. 1976, pp. 412, 413.
IBM Tech Discl Bull, vol. 3, No. 1, Jun. 1988, p. 2, Film on Metal Leaded Chip Carrier.
Samsung Electronics America, Inc.
Tolin Gerald P.
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