Measuring and testing – Surface and cutting edge testing – Roughness
Reexamination Certificate
2005-09-20
2008-03-04
Larkin, Daniel S. (Department: 2856)
Measuring and testing
Surface and cutting edge testing
Roughness
Reexamination Certificate
active
07337656
ABSTRACT:
In order to establish processing techniques capable of making multi-tip probes with sub-micron intervals and provide such microscopic multi-tip probes, there is provided an outermost surface analysis apparatus for semiconductor devices etc. provided with a function for enabling positioning to be performed in such a manner that there is no influence on measurement in electrical measurements at an extremely small region using this microscopic multi-tip probe, and there are provided the steps of making a cantilever1formed with a plurality of electrodes3using lithographic techniques, and forming microscopic electrodes6minute in pitch by sputtering or gas-assisted etching a distal end of the cantilever1using a focused charged particle beam or using CVD.
REFERENCES:
patent: 5266801 (1993-11-01), Elings et al.
patent: 6000281 (1999-12-01), Burke
patent: 6028305 (2000-02-01), Minne et al.
patent: 6079255 (2000-06-01), Binnig et al.
patent: 6328902 (2001-12-01), Hantschel et al.
patent: 6465782 (2002-10-01), Kendall
patent: 6884999 (2005-04-01), Yedur et al.
patent: 2001-255257 (2001-09-01), None
Arai Tadashi
Shirakawabe Yoshiharu
Takahashi Hiroshi
Adams & Wilks
Larkin Daniel S.
SII NanoTechnology Inc.
LandOfFree
Surface characteristic analysis apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Surface characteristic analysis apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface characteristic analysis apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3979378