Measuring and testing – Vibration – Sensing apparatus
Reexamination Certificate
2007-01-23
2007-01-23
Williams, Hezron (Department: 2856)
Measuring and testing
Vibration
Sensing apparatus
C073S778000, C073S862042, C310S31300R, C310S31300R
Reexamination Certificate
active
11017171
ABSTRACT:
Sensor systems and methods are disclosed herein, including a sensor chip, upon which at least two surface acoustic wave (SAW) sensing elements are centrally located on a first side (e.g., front side) of the sensor chip. The SAW sensing elements occupy a common area on the first side of the sensor chip. An etched diaphragm is located centrally on the second side (i.e., back side) of the sensor chip opposite the first side in association with the two SAW sensing elements in order to concentrate the mechanical strain of the sensor system or sensor device in the etched diagram, thereby providing high strength, high sensitivity and ease of manufacturing thereof.
REFERENCES:
patent: 4100811 (1978-07-01), Cullen et al.
patent: 4216401 (1980-08-01), Wagner
patent: 4326423 (1982-04-01), Hartemann
patent: 4361026 (1982-11-01), Muller et al.
patent: 4454440 (1984-06-01), Cullen
patent: 5189914 (1993-03-01), White et al.
patent: 5471723 (1995-12-01), Luder et al.
patent: 5821425 (1998-10-01), Mariani et al.
patent: 6079276 (2000-06-01), Frick et al.
patent: 6300706 (2001-10-01), Grudkowski et al.
patent: 6327590 (2001-12-01), Chidlovskii et al.
patent: 6374678 (2002-04-01), Masuda
patent: 6484585 (2002-11-01), Sittler et al.
patent: 6541893 (2003-04-01), Zhu et al.
patent: 6550337 (2003-04-01), Wagner et al.
patent: 6571638 (2003-06-01), Hines et al.
patent: 2004/0216526 (2004-11-01), Cook et al.
patent: 10054198 (2001-09-01), None
patent: WO 03/034013 (2003-04-01), None
patent: WO 03/081195 (2003-10-01), None
Benes et al., Piezoelekrische Resonatoren als Sensorlemente, Elektrotechnik Und Informationstechnik, Springer Verlag, Wien, At, vol. 122, No. 9, Sep. 1995, pp. 471-483.
Buff et al., Universal Pressure and Temperature Saw Sensor for Wireless Applications, 1997 Ultrasonics Symposium, 1997 IEEE Tronto, Ont., Canada Oct. 5-8, 1997, p. 359-362.
Bulst et al., State of the Art in Wireless Sensing with Surface Acoustic Waves, Industrial Electronics Society, 1998. IECON 1998, vol. 4, Aug. 31, 1998, pp. 2391-2396.
Cook James D.
Liu James Z.
Magee Steven J.
Honeywell International , Inc.
Lopez Kermit D.
Miller Rose M.
Shelby William B.
Williams Hezron
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