Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal
Reexamination Certificate
2006-02-14
2006-02-14
Nguyen, Tuan H. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
C257S416000, C257S795000
Reexamination Certificate
active
06998687
ABSTRACT:
A surface acoustic wave (SAW) device having improved moisture resistance is provided. The device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode on a first surface of the piezoelectric substrate, and a resin coating for covering the IDT electrode. After a piece of resin material of the resin coating is dipped in an amount of pure water as solvent having a mass as 10 times great as the piece of resin material at 120° C. under 2 atom pressure for twenty hours, a concentration of chlorine ion in the solvent is not higher than 50 ppm.
REFERENCES:
patent: 6078123 (2000-06-01), Tanaka et al.
patent: 60-054458 (1985-03-01), None
patent: 62-150752 (1987-07-01), None
patent: 63-81957 (1988-04-01), None
patent: 63-310938 (1988-12-01), None
patent: 03-222443 (1991-10-01), None
patent: 63081957 (1998-04-01), None
patent: 10163799 (1998-06-01), None
patent: 10-163799 (1998-06-01), None
patent: 11-163661 (1999-06-01), None
patent: 11163661 (1999-06-01), None
patent: 2000-58593 (2000-02-01), None
patent: WO99/05788 (1999-02-01), None
Japanese Search report for PCT/JP02/00498 dated Mar. 26, 2002.
European Search Report for Application No. EP 02 71 6356, dated Feb. 15, 2005.
Inoue Takashi
Matsuo Satoshi
Namba Akihiko
Matsushita Electric - Industrial Co., Ltd.
Nguyen Tuan H.
RatnerPrestia
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