Wave transmission lines and networks – Coupling networks – Electromechanical filter
Reexamination Certificate
2008-07-08
2008-07-08
Summons, Barbara (Department: 2817)
Wave transmission lines and networks
Coupling networks
Electromechanical filter
C310S31300R, C310S340000
Reexamination Certificate
active
07397327
ABSTRACT:
A surface acoustic wave filter includes a device chip, one principal surface of a piezoelectric substrate having a wiring pattern including IDTs and pads electrically connected to the IDTs, that is disposed so as to oppose a mount board, with the pads being electrically connected to lands of the mount board through bumps. A resin film covers the other principal surface of the piezoelectric substrate and the principal surface of the mount board to seal the device chip. In the piezoelectric substrate, the area of the one principal surface is greater than the area of the other principal surface.
REFERENCES:
patent: 3781721 (1973-12-01), Judd et al.
patent: 6570469 (2003-05-01), Yamada et al.
patent: 2002/0159242 (2002-10-01), Nakatani et al.
patent: 55-41048 (1980-03-01), None
patent: 58-077921 (1983-05-01), None
patent: 60-176317 (1985-09-01), None
patent: 62-257210 (1987-11-01), None
patent: 03-036219 (1991-04-01), None
patent: 04-087410 (1992-03-01), None
patent: 10-041438 (1998-02-01), None
patent: 2000-312127 (2000-11-01), None
patent: 2002-198487 (2002-07-01), None
patent: 2003-17979 (2003-01-01), None
patent: 2003-032061 (2003-01-01), None
patent: 2003-204032 (2003-07-01), None
Keating & Bennett LLP
Murata Manufacturing Co. Ltd.
Summons Barbara
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