Surface acoustic wave devices having a guard layer

Details Surface acoustic wave devices having a guard layer Surface acoustic wave devices having a guard layer

1996-03-27

1997-12-16

Lee, Benny

Wave transmission lines and networks

Coupling networks

Electromechanical filter

310313R, 310344, 310348, H03H 900

Patent

active

056990278

ABSTRACT:
A surface acoustic wave device including a dielectric substrate having an input electrode and an output electrode and a grounding electrode on a first surface of the dielectric substrate, and an outer electrode on a second surface of the dielectric substrate; and a surface acoustic wave element having an electrode pad and a comb-shaped electrode disposed on a first surface of the surface acoustic wave element. The surface acoustic wave element is bonded to the dielectric substrate via a metal bump and a conductive resin formed on the electrode pad. The surface acoustic wave device further includes an insulating resin deposited on the periphery of the metal bump, and a guard layer shorter in height than the surface acoustic wave element formed adjacent the surface acoustic wave element on the first surface of the dielectric substrate.

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Patent Abstracts Of Japan, vol. 16, No. 255 (E-1214)(Jun. 10, 1992).

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