Surface acoustic wave device sealing method

Details Surface acoustic wave device sealing method Surface acoustic wave device sealing method

1986-10-16

1987-10-13

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29594, 310313R, 310313B, 310313C, 333150, 333154, B32B 3112

Patent

active

046996826

ABSTRACT:
A surface acoustic wave device sealing method prepares a cavity-defining member and lead members for electrical connection. A surface acoustic wave element having a wave propagation surface and electrodes is bonded to the cavity member by an adhesive applied to the circumferential edge of the cavity so that the propagation surface is opposed to the interior of the cavity, and the electrodes are exposed to the exterior of the cavity member. The electrodes are connected to the lead members, and the resulting unitary body is sealed by a mass of resin.

REFERENCES:
patent: 4047129 (1977-09-01), Ishiyama
patent: 4213104 (1980-07-01), Cullen et al.
patent: 4291285 (1981-09-01), Kadota
patent: 4296347 (1981-10-01), Weirauch
patent: 4306456 (1981-12-01), Maerfeld

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