Surface acoustic wave device package

Details Surface acoustic wave device package Surface acoustic wave device package

1991-09-30

1993-08-17

Budd, Mark O.

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

310344, 29 2535, H01L 4108

Patent

active

052372359

ABSTRACT:
A surface acoustic wave (SAW) device package for reducing insertion loss and direct RF feedthrough of the SAW device is disclosed. The package provides for extensive shielding of each of the input and output pads. The inputs and outputs to the SAW device are separated by maintaining the inputs on one surface of the substrate and the outputs on the opposite surface of the substrate. The SAW crystal substrate including the SAW devices is bonded to the package substrate and the package is hermetically sealed via a low-temperature glass seal or solder-type sealing, for example.

REFERENCES:
patent: 3885173 (1975-05-01), Lee
patent: 3982113 (1976-09-01), Caldran
patent: 4213104 (1980-07-01), Cullen et al.
patent: 4381469 (1983-04-01), Ogawa et al.
patent: 4480148 (1984-10-01), Archer
patent: 4734608 (1988-03-01), Takoshima
patent: 4795934 (1989-01-01), Rogerson et al.
patent: 4993000 (1991-02-01), Niitsuma et al.
patent: 5059848 (1991-10-01), Mariani

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