Surface acoustic wave device mounted with a resin film and metho

Details Surface acoustic wave device mounted with a resin film and metho Surface acoustic wave device mounted with a resin film and metho

1998-08-04

2000-06-20

Pascal, Robert

Wave transmission lines and networks

Coupling networks

Electromechanical filter

310313R, 310313B, 310348, 29 2535, 360807, H03H 905, H03H 964

Patent

active

060782293

ABSTRACT:
It is an object on the invention to provide a SAW device sealed by resin, which is low priced and suited for decreasing its thickness and weight and requires no particular course for processing a substrate, and a method for fabricating the same. A functional surface of a piezoelectric substrate provided with interdigtal transducers and a mounting surface of a circuit substrate are opposed to each other to form vibration cavities for surface wave propagation areas therebetween. Electrical power is supplied to the piezoelectric substrate from the circuit substrate via electrode pads formed on respective inner surface of both the substrate and bumps inserted therebetween. A resin film adheres to the respective inner surfaces of both the substrates except the surface wave propagation areas to shield the vibration cavity from the environmental space. Apertures are previously formed at predetermined parts of the resin film by means of a laser. A resin film is temporarily adhered to the inner surface of the circuit substrate for instance, and positioning of both the substrates are adjusted relative to each other. Thereafter, both the substrates are permanently adhered to each other by hot-pressing them, and sealing is completed.

REFERENCES:
patent: 5359494 (1994-10-01), Morimoto
patent: 5699027 (1997-12-01), Tsuji et al.
patent: 5760526 (1998-06-01), Anderson

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