Surface acoustic wave device having a lamination structure

Details Surface acoustic wave device having a lamination structure Surface acoustic wave device having a lamination structure

1994-03-15

1995-08-29

Dougherty, Thomas M.

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

H01L 4108

Patent

active

054463300

ABSTRACT:
A surface acoustic wave device includes: a single crystal piezoelectric substrate; a single crystal piezoelectric thin plate formed on the single crystal piezoelectric substrate, the single crystal piezoelectric thin plate being bonded to the single crystal piezoelectric substrate by direct bonding; and interdigital transducers formed on the single crystal piezoelectric thin plate, for exciting a surface acoustic wave in at least the single crystal piezoelectric thin plate.

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patent: 5373579 (1994-12-01), Eda
"LiNbO.sub.3 -Quartz-LiNbO.sub.3 Composite Delay Line with Zero Linear Temperature Coefficient of Delay", by M. Wauk, Mar. 4, 1974, pp. 109-110, Electronics Letters Apr. 4, 1974, vol. 10, No. 7.
S. Fujishima, "An Overview of Japanese Manufacturing of Saw Devices", IEEE-MTT-S International Microwave Symposium Digest, pp. 561-564, (Jun. 2-4, 1986).
G. G. Goetz et al., "Generalized Bonding", 1989 IEEE SOS/SOI Technology Conference, pp. 125-126 (Oct. 3-5, 1989).
European Search Report corresponding to European Patent No. 94104005.7 (Jul. 11, 1994).
A. Armstrong, "High coupling Efficiency for Zinc Oxide Overlays on Lithium Niobate", 1972 Ultrasonics Symposium Proceedings, pp. 370-372 (1972).

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