Surface acoustic wave device and method of manufacture

Details Surface acoustic wave device and method of manufacture Surface acoustic wave device and method of manufacture

1996-05-08

1998-10-13

Budd, Mark O.

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

310344, H01L 4108

Patent

active

058216650

ABSTRACT:
A compact, low height, low cost, and high reliability surface acoustic wave device, and its method of manufacture. The surface acoustic wave device consists of a substrate, a comb-electrode disposed on the main surface of the substrate, plural electrode pads disposed around the comb-electrode, protecting means covering the comb-electrode through a closed space produced by combining the comb-electrode and the electrode pads with the substrate by using substantially covalent bonding force acting between conductive bumps formed on the electrode bumps, a conductive adhesive layer disposed at least on the top of the conductive bumps, and a package adhered on the conductive bumps by means of the conductive adhesive, and insulation adhesive filled into the package contacting the conductive adhesive, the conductive bumps and the protective means.

REFERENCES:
patent: 4270105 (1981-05-01), Parker et al.
patent: 4699682 (1987-10-01), Takishima
patent: 5448126 (1995-09-01), Eda et al.
patent: 5453652 (1995-09-01), Eda et al.
patent: 5471722 (1995-12-01), Yatsuda
(1) Kazuo Eda, Keiji Ohnishi et al., "Flip-Chip Bonding Technology Fabricates GHz-Band Saw Filters," JEE Journal of Electronic Engineering, No. 324, (Dec. 1993), 4 pp.
(2) European Search Report No. 96107281.6 (Sep. 5, 1996).

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