Surface acoustic wave device and method for manufacturing same

Details Surface acoustic wave device and method for manufacturing same Surface acoustic wave device and method for manufacturing same

2006-12-26

2006-12-26

Tamai, Karl (Department: 2834)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

Reexamination Certificate

active

07154206

ABSTRACT:
A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substrate10with one principal surface thereof formed with an IDT electrode11,a connector electrode12and a periphery sealing electrode13,and a base substrate2formed with an electrode21for connection to the element connected to the connector electrode12through a solder bump component3and a periphery sealing conductor film22joined to the periphery sealing electrode13thorough a solder sealing component4.For the solder bump component3and the solder sealing component4,a Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrate2is set in the range of 9–20 pm/° C. The joining is accomplished with high stability resisting thermal stress due to a difference in thermal expansion coefficient, so that a surface acoustic wave device that can maintain stable connection for a long duration of time can be provided.

REFERENCES:
patent: 6262513 (2001-07-01), Furukawa et al.
patent: 6498422 (2002-12-01), Hori
patent: 6643920 (2003-11-01), Hori
patent: 6815869 (2004-11-01), Baba et al.
patent: 10-270979 (1998-09-01), None

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