Surface acoustic wave device

Details Surface acoustic wave device Surface acoustic wave device

2006-09-05

2006-09-05

Takaoka, Dean (Department: 2817)

Wave transmission lines and networks

Plural channel systems

Having branched circuits

C333S195000, C310S31300R, C310S340000

Reexamination Certificate

active

07102462

ABSTRACT:
The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of the spiral inductor. The chip on which the spiral inductor is formed is flip-chip mounted in a package together with another surface acoustic wave device chip. The package is provided with a hermetically sealed lid. A conductor pattern is formed on a face of the package that opposes the spiral inductor. Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.

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