Abrasive tool making process – material – or composition – With carbohydrate or reaction product thereof
Patent
1987-02-02
1988-09-27
Schmidt, Frederick R.
Abrasive tool making process, material, or composition
With carbohydrate or reaction product thereof
51133, B24B 3704
Patent
active
047731850
ABSTRACT:
Surface abrading machines such as lapping machines of the type that lap both surfaces of the works, such as semiconductor wafers, using an upper lap and a lower lap between which such works are positioned by means of holders. The design object is to enhance the accuracy of lapping by reducing to a minimum the rotation of holders, thereby reducing the speed difference at different points of the holders and, therefore, the works carried thereby. When a central gear 18, which constitutes a work holding mechanism, is moved by the rotation of an eccentric cam 15 mounted over a drive shaft 3, an internal gear 28 supported inside a support ring, which is a pin gear 27, like a differential gear revolves at a low speed along the support ring 27 while being moved like the central gear 18 through the holders 30 placed between and engaged with the internal gear 28 and the central gear 18. The rotating speeds of the central gear 18 and the holders 30 are so slow that the speed difference at different points of the rotating holders is kept to a minimum, as a result of which the works are lapped by the upper and lower laps 10 and 20 under substantially uniform conditions and, therefore, with a higher degree of accuracy.
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Planetary "Free" Wafer Polishing, Goetz et al., IBM Technical Dislcosure Bulletin, vol. 15, No. 6, 11-1972.
Linden Integral Research, Inc.
Rose Robert A.
Schmidt Frederick R.
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