Suppressing lithography at a wafer edge

Details Suppressing lithography at a wafer edge Suppressing lithography at a wafer edge

2005-11-01

2005-11-01

Chen, Kin-Chan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S719000

Reexamination Certificate

active

06960532

ABSTRACT:
Damage to the rim of a semiconductor wafer caused by etching processes is reduced by forming a rim of carbonized photoresist around the outer edge of the wafer, using a wafer edge tool to carbonize the outer rim of a positive tone photoresist.

REFERENCES:
patent: 5405734 (1995-04-01), Aita
patent: 5866481 (1999-02-01), Tsai et al.
patent: 6507034 (2003-01-01), Nakasugi
patent: 6520844 (2003-02-01), Iwasaki et al.
patent: 6713236 (2004-03-01), Chen
patent: 2004/0005516 (2004-01-01), Chen

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