Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2011-02-28
2011-12-20
Chan, Sing P (Department: 1745)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S703000
Reexamination Certificate
active
08080123
ABSTRACT:
A method for stripping a supporting plate from a circuit-formed surface of a substrate to which it is bonded with an adhesive by using a plate which has a first penetrating hole formed in a substantially central portion thereof in the thickness direction, a second penetrating hole formed in a peripheral portion thereof in the thickness direction, and a hole for attracting the supporting plate formed between the first penetrating hole and the second penetrating hole in the radial direction of the plate. The method involves supplying a solvent from outside to the first penetrating hole of the plate and to an associated first penetrating hole formed in a substantially central portion of the supporting plate; distributing the solvent from the first penetrating hole of the supporting plate through grooves formed on a surface of the supporting plate in contact with the adhesive and connecting with the first penetrating hole of the supporting plate; dissolving the adhesive with the solvent; and draining the solvent from a second penetrating hole connecting with the grooves and formed in a peripheral portion of the supporting plate and the second penetrating hole formed in the plate.
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Inao Yoshihiro
Miyanari Atsushi
Nakamura Akihiko
Blackman William D.
Carrier Joseph P.
Carrier Blackman & Associates P.C.
Chan Sing P
Tokyo Ohka Kogyo Co. Ltd.
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