Supporting member for cooling means, electronic package and meth

Details Supporting member for cooling means, electronic package and meth Supporting member for cooling means, electronic package and meth

1995-12-15

1998-09-29

Arroyo, Teresa Maria

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438121, 438106, H01L 2100, H01L 2170, H01L 2334

Patent

active

058145354

ABSTRACT:
An electronic package according to the present invention comprises a supporting member, an electronic device, a carrier, a substrate and cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling means is attached onto and supported by the upper surface of the plate.

REFERENCES:
patent: 3780795 (1973-12-01), Arnold
patent: 4853828 (1989-08-01), Penn
patent: 5247425 (1993-09-01), Takahasi
patent: 5261155 (1993-11-01), Angulas et al.
patent: 5424919 (1995-06-01), Hielbronner
patent: 5442234 (1995-08-01), Liang
R. Tummala et al.; "Microelectronics Packaging Handbook", Van Nostrand Reinhold, 1989; pp. 209-219 and p. 422.

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