Supportable contact and chip carrier socket for use with an asse

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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439 72, 439 83, 439331, 439526, H01R 909

Patent

active

052958418

ABSTRACT:
An improved contact for use in a high density chip carrier socket mounted on a circuit member which utilizes a cover which to wedge the leads of the chip carrier into electrical engagement with a respective contact. A tool receiving recess is incorporated into the contact so that the forces exerted on the socket while pressing the cover into place can be opposed, minimizing the forces exerted on the connection between the socket and the circuit member, typically a solder joint. Providing a tool, that operates from one side of the circuit member, in order to press the cover into place while engaging the contact recess to oppose the insertion related forces, which can also pull the cover from the contacts, without exerting significant forces on the connection, by engaging a lip in the cover while pressing on the carrier.

REFERENCES:
patent: 4679319 (1987-07-01), Grabbe et al.
patent: 4827607 (1989-05-01), Korsunsky et al.
patent: 4872845 (1989-10-01), Korsunsky et al.
patent: 4873761 (1989-10-01), Korsunsky et al.
patent: 5007845 (1991-04-01), Grabbe
patent: 5062802 (1991-11-01), Grabbe
patent: 5192215 (1993-03-01), Grabbe et al.
AMP Product Info. Bulletin (One Sheet)-7201-92-03. Issued May 1992 Published by Inventors' Employer within one year of filing date.

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