Support system for semiconductor wafers and methods thereof

Details Support system for semiconductor wafers and methods thereof Support system for semiconductor wafers and methods thereof

2006-06-06

2006-06-06

Wilson, Lee D. (Department: 3723)

Metal working

Means to assemble or disassemble

With work-holder for assembly

C269S021000, C451S388000

Reexamination Certificate

active

07055229

ABSTRACT:
A semiconductor wafer may be secured to a wafer support system by causing a supported surface of the semiconductor wafer to be at a lower gas pressure than an exposed surface of the semiconductor wafer.

REFERENCES:
patent: 4535834 (1985-08-01), Turner
patent: 4603466 (1986-08-01), Morley
patent: 6012509 (2000-01-01), Nonaka
patent: 6464790 (2002-10-01), Sherstinsky et al.
patent: 6852019 (2005-02-01), Togawa et al.
patent: 2003/0026904 (2003-02-01), Yadav et al.
patent: 2003/0037400 (2003-02-01), Hunter et al.
patent: 2003/0211813 (2003-11-01), Kassir et al.
patent: 2003/0234078 (2003-12-01), Hsu et al.

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