Support structures for semiconductor devices

Details Support structures for semiconductor devices Support structures for semiconductor devices

2005-10-12

2009-12-01

Purvis, Sue (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S775000, C257SE23012, C257SE23015

Reexamination Certificate

active

07626268

ABSTRACT:
Support structures for semiconductor devices and methods of manufacturing thereof are disclosed. In some embodiments, the support structures include a plurality of support members that is formed in a substantially annular shape beneath a wire bond region. The central region inside the substantially annular shape of the plurality of support members may be used to route functional conductive lines for making electrical contact to active areas of the semiconductor device. Dummy support structures may optionally be formed between the functional conductive lines. The support structures may be formed in one or more conductive line layers and semiconductive material layers of a semiconductor device. In other embodiments, support members are not formed in an annular shape, and are formed in insulating layers that do not comprise low dielectric constant (k) materials.

REFERENCES:
patent: 5739587 (1998-04-01), Sato
patent: 5986343 (1999-11-01), Chittipeddi et al.
patent: 6258715 (2001-07-01), Yu et al.
patent: 6313024 (2001-11-01), Cave et al.
patent: 6444295 (2002-09-01), Peng et al.
patent: 2002/0043727 (2002-04-01), Wu
patent: 2005/0073058 (2005-04-01), Kuo et al.
patent: 2006/0157849 (2006-07-01), Goller et al.

Affiliated with

Also associated with

Rating

Support structures for semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Support structures for semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Support structures for semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4069881