Support structure for thin semiconductor wafer

Details Support structure for thin semiconductor wafer Support structure for thin semiconductor wafer

1978-03-01

1980-05-20

Wojciechowicz, Edward J.

357 68, 357 69, H01L 2906

Patent

active

042042186

ABSTRACT:
Semiconductor chips for certain types of devices must be extremely thin, typically less than two mils in thickness. They are therefore extremely fragile and difficult to handle. Such chips are provided with increased strength and rigidity by the addition of a deposited metal frame member on one surface of the chip encompassing the electrode pattern. The frame member has a thickness several times that of the electrode pattern.

REFERENCES:
patent: 3335338 (1967-08-01), Lepselter
patent: 3657610 (1972-04-01), Yamamoto et al.
patent: 4072982 (1978-02-01), Stein

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