Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
1998-04-13
2002-10-29
Cuneo, Kamand (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S264000, C174S266000, C361S768000, C310S31300R, C310S348000
Reexamination Certificate
active
06472610
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a support structure for an electronic component such as a piezoelectric vibrator, and also relates to an electronic component such as a piezoelectric transformer, a gyroscope and a multilayered piezoelectric component including the inventive support structure.
2. Description of the Related Art
A conventional electronic component and support structure, for example, in the form of a piezoelectric transformer, is shown in
FIGS. 17 and 18
. A piezoelectric transformer
80
may be used in, for example, a high-voltage power-supply circuit of an inverter for a back light of a liquid-crystal display, an inverter for switching on a fluorescent lamp or a copier, and other similar devices. The piezoelectric transformer
80
includes a piezoelectric transformer element
85
having input electrodes
82
and
83
and an output electrode
84
provided on a piezoelectric plate
81
made of a piezoelectric ceramic in the shape of a rectangular flat-plate. The input electrodes
82
and
83
are arranged so that they are located opposite to each other on the top and bottom surfaces of a half section which in
FIGS. 17 and 18
is on the left side of the piezoelectric plate
81
as seen in
FIGS. 17 and 18
. The output electrode
84
is disposed on the surface on the right side of the piezoelectric plate
81
of
FIGS. 17 and 18
.
In the piezoelectric transformer
80
, the piezoelectric transformer element
85
operates in a fundamental (primary) vibration mode called a &lgr;/2 mode, wherein a node (node point) N of vibration at which the vibration displacement is zero is present at a position located at one half of a length of the piezoelectric plate
81
, and a maximum point of vibration displacement is located at the two ends of the piezoelectric plate
81
. Therefore, in such a piezoelectric transformer
80
, in order to minimize the suppression of vibration of the piezoelectric plate
81
, the piezoelectric transformer element
85
is supported on a mounting substrate
89
at the node N of vibration at which the displacement of the vibration of the piezoelectric plate
81
is minimum.
A conductive bonding agent
86
or the like is used to electrically and physically connect the piezoelectric plate
81
to the mounting substrate
89
. Each of the electrodes
82
to
84
is electrically connected by the conductive bonding agent
86
to a terminal electrode
90
disposed on the mounting substrate
89
.
As shown in
FIG. 17
, after the piezoelectric transformer element
85
is placed on the mounting substrate
89
to which the conductive bonding agent
86
is applied in advance, the conductive bonding agent
86
is hardened, and thereby the mounting is completed. Alternatively, the conductive bonding agent
86
is applied to the piezoelectric transformer element
85
in advance and then the transformer
85
including the conductive bonding agent
86
is placed on the mounting substrate
89
, the conductive bonding agent
86
is hardened, and thereby the mounting is completed. Alternatively, as shown in
FIG. 18
, after the piezoelectric transformer element
85
is positioned on the mounting substrate
89
, the conductive bonding agent
86
is applied to the side surface of the piezoelectric transformer element
85
by a dispenser
92
and the like, and hardened, thereby the mounting is performed.
In the conventional piezoelectric transformer
80
, since the conductive bonding agent
86
used when the piezoelectric transformer element
85
is mounted on the mounting substrate
89
must have a certain degree of elasticity, denatured urethane and silicon, soft epoxy, and the like is used for as a binder material included therein. Although these materials cause the conductive bonding agent
86
to have elasticity, the materials have a weak bonding force. In particular, the bonding force with respect to the solder used in the electrodes
82
to
84
of the mounting substrate
89
is weak, and when an impact or the like is applied to the piezoelectric transformer
80
after it is mounted on the substrate
89
, problems such as peeling or removal of the conductive bonding agent
86
from the electrodes
82
to
84
of the mounting substrate
89
occurs.
SUMMARY OF THE INVENTION
In order to overcome the problems described above, the preferred embodiments of the present invention provide a novel support structure for an electronic component including a piezoelectric vibrator, a piezoelectric transformer, a gyroscope or a multilayered piezoelectric component, which support structure is constructed to improve bonding strength between a conductive bonding agent and a mounting substrate without decreasing an elasticity of the conductive bonding agent.
The preferred embodiments of the present invention provide a support apparatus for an electronic component including a mounting substrate on which the electronic component is mounted, at least one terminal electrode provided on the mounting substrate, a hole provided on the mounting substrate and located at a position corresponding to a position of the terminal electrode, and a conductive bonding agent disposed in the hole and arranged to electrically connect the electronic component to the terminal electrode.
It is also preferred that the at least one terminal provided on the mounting substrate has a hole formed therein, which hole is located in alignment with the hole formed in the mounting substrate, with the conductive bonding agent being located in the hole formed in the mounting substrate and the hole formed in the at lest one terminal.
The preferred embodiments of the present invention provide an electronic component including a mounting substrate on which the electronic component is mounted, at least one terminal electrode provided on the mounting substrate, a hole provided on the mounting substrate and located at a position corresponding to a position of the terminal electrode, and a conductive bonding agent disposed in the hole and arranged to electrically connect the electronic component to the terminal electrode.
The preferred embodiments of the present invention provide a piezoelectric vibrator including a piezoelectric body and a plurality of input and output electrodes provided on a surface of the piezoelectric body, a mounting substrate on which the piezoelectric body is mounted, a terminal electrode provided on the mounting substrate, a hole provided on the mounting substrate and located at a position corresponding to a position of the terminal electrode, and a conductive bonding agent disposed in the hole and arranged to electrically connect at least one of the input and output electrodes to the terminal electrode.
According to another preferred embodiment of the present invention, a piezoelectric transformer includes a piezoelectric transformer element including a piezoelectric plate and an input electrode and an output electrode disposed on the piezoelectric plate, a mounting substrate on which the piezoelectric transformer element is mounted, a plurality of terminal electrodes provided on the mounting substrate, and a plurality of holes provided in the mounting substrate and located at positions corresponding to locations of the terminal electrodes, and a conductive bonding agent located in the holes and arranged to electrically connect at least one of the input and output electrodes to at least one of the terminal electrodes.
Another preferred embodiment of the present invention provides a gyroscope including a prismatic vibrator with a plurality of piezoelectric elements provided on the surface of the prismatic vibrator, each of the piezoelectric elements including a piezoelectric body and an electrode on the surface of the piezoelectric body, a mounting substrate on which the prismatic vibrator is mounted, a terminal electrode provided on the mounting substrate; a hole provided in the mounting substrate and located at a position corresponding to a location of the terminal electrode, and a conductive bonding agent located in the hole and arranged to el
Cuneo Kamand
Keating & Bennett LLP
Murata Manufacturing Co. Ltd.
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