Support member assembly for electroconductive contact members

Details Support member assembly for electroconductive contact members Support member assembly for electroconductive contact members

2006-05-30

2006-05-30

Nguyen, Vinh P. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S755090

Reexamination Certificate

active

07053635

ABSTRACT:
The support member assembly1is formed by laminating a plurality of plastic layered assemblies6each incorporated with a reinforcing plate3and integrally joining them by heating. Holder holes2are formed in the parts of the assembly corresponding to the openings3aof the reinforcing plates3.The reinforcing member increases the overall mechanical strength of the support member assembly. Furthermore, because a number of reinforcing plates can be layered and each reinforcing plate may be provided with a small thickness, the working of the strips of the reinforcing plates between adjacent openings can be achieved without any difficulty, and the manufacturing cost of such a support member assembly can be reduced. When each plastic layered assembly comprises plastic material formed by impregnating non-woven fabric with thermosetting resin, the drilling of holder holes for receiving electroconductive contact members can be more favorably and economically performed.

REFERENCES:
patent: 4311352 (1982-01-01), Kochsmeier
patent: 4763641 (1988-08-01), Smith
patent: 6097089 (2000-08-01), Gaku et al.
patent: 6556033 (2003-04-01), Kazama
patent: 0 995 996 (2000-04-01), None
patent: 1 113 274 (2001-07-01), None
patent: 2001-223247 (2001-08-01), None
patent: 2002-139513 (2002-05-01), None
English Language Abstract, Japanese Patent No. JP2001-223247, Published Aug. 17, 2001.
English Language Abstract, Japanese Patent No. JP2002139513, Published May 17, 2002.

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