Support frame for semiconductor packages

Details Support frame for semiconductor packages Support frame for semiconductor packages

2005-10-18

2005-10-18

Tran, Thien F (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S434000

Reexamination Certificate

active

06956272

ABSTRACT:
A semiconductor die package having an elastomeric substrate with a first support frame and a second support frame. The first support frame has a cavity within which a semiconductor die is placed. The second support frame may have an optional cavity. The optional cavity in the second support frame may have an optional rigid structure. The rigid structure may have a heating element formed within it.

REFERENCES:
patent: 5790378 (1998-08-01), Chillara
patent: 6268650 (2001-07-01), Kinsman et al.
patent: 6469376 (2002-10-01), Vaiyapuri
patent: 6541284 (2003-04-01), Lam
patent: 2001/0052642 (2001-12-01), Wood et al.

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