Support for wafer-like objects

Cleaning and liquid contact with solids – Apparatus – With means to movably mount or movably support the work or...

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Details

134157, 134902, B08B 302

Patent

active

058968776

ABSTRACT:
In the case of a support 1 for wafer-like object 2, which in its surface ing toward wafer-like object 2 has a ring-shaped die 8 for the discharge of compressed gas, there is a circular step 10 that is located radially outside of ring-shaped die 8. Treatment fluid 15, which is applied to the upper side of an object 2, which is secured to a support 1 that is equipped with step 10, flows around circumferential edge 16 of object 2 onto underside 17 of said object and wets an area of underside 17 of object 2 that is located radially outside of step 10 until it is blown away radially outward by the gas emerging from tubular die 8. This provides the advantage that treatment fluid 15 not only reaches circumferential edge 16 of object 2, but also reaches into a ring-shaped area of underside 17 of wafer-like object 2 that faces toward support 1 and can exert its action there.

REFERENCES:
patent: 5513668 (1996-05-01), Sumnitsch

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