Support device for heat dissipation module

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S104330

Reexamination Certificate

active

07808782

ABSTRACT:
A support device for heat dissipation module provides a frame with four corners thereof extending outward a support part respectively. A mounting opening is disposed at the central area of the frame with two opposite side of the mounting opening having a projection plate respectively. A facial side of the projection plate is provided with fitting pins to fit with a guide heat plate and covering the mounting opening without help of welding. Therefore, thinner guide heat plate can be used for simplifying manufacturing process and lowering production cost.

REFERENCES:
patent: 6105215 (2000-08-01), Lee
patent: 7304850 (2007-12-01), Sun
patent: 7551446 (2009-06-01), Handley et al.
patent: 2006/0144572 (2006-07-01), Yu et al.
patent: 2006/0158850 (2006-07-01), Lee et al.
patent: 2006/0260787 (2006-11-01), Wu et al.
patent: 2007/0217155 (2007-09-01), Zhao et al.
patent: 2007/0251670 (2007-11-01), Peng et al.

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