Support body for semiconductor element, method for...

Details Support body for semiconductor element, method for... Support body for semiconductor element, method for...

2007-12-04

2007-12-04

Weiss, Howard (Department: 2814)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

C438S068000, C438S508000, C257SE21599, C361S736000, C174S250000

Reexamination Certificate

active

10974889

ABSTRACT:
A semiconductor device comprises a semiconductor element and a support body made of a stack of ceramic layers having a recess in which electrical conductors are electrically connected with the semiconductor element, wherein at least a part of a top face of a recess side wall is covered by a resin, thereby providing a light emitting device.

REFERENCES:
patent: 6621010 (2003-09-01), Sakai et al.
patent: 6727111 (2004-04-01), Tsukada
patent: 6751101 (2004-06-01), Sakai
patent: 6760227 (2004-07-01), Sakai et al.
patent: 7091581 (2006-08-01), McLellan et al.
patent: 7112470 (2006-09-01), Daubenspeck et al.
patent: 7122489 (2006-10-01), Cheng et al.
patent: 2002/0094607 (2002-07-01), Gebauer et al.
patent: 2005/0151247 (2005-07-01), Nagano et al.
patent: 52-058468 (1977-05-01), None
patent: 63-229797 (1988-09-01), None
patent: 02-036094 (1990-02-01), None
patent: 07-040296 (1995-02-01), None
patent: 2003-036094 (2003-02-01), None

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