Support board separating apparatus, and support board...

Details Support board separating apparatus, and support board... Support board separating apparatus, and support board...

2011-05-10

2011-05-10

Wyrozebski, Kat (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C156S248000, C156S583200, C438S015000, C438S464000, C029S830000, C324S754090

Reexamination Certificate

active

07938930

ABSTRACT:
An aligned workpiece is mounted on and held by a holding table, and a support board separating mechanism separates a support board from a semiconductor wafer. Herein, a double-faced adhesive tape is left on one of the support board and the semiconductor wafer. Either the support board or the semiconductor wafer on which the double-faced adhesive tape is left is transported to an adhesive tape peeling mechanism while being held by the holding table, and the double-faced adhesive tape is peeled off and removed from the surface of thereof. The separated semiconductor wafer and support board are collected independently.

REFERENCES:
patent: 6627037 (2003-09-01), Kurokawa et al.
patent: 7384811 (2008-06-01), Miyamoto et al.
patent: 7393757 (2008-07-01), Miyamoto et al.
patent: 2003/0060021 (2003-03-01), Kurosawa et al.
patent: 2003/0064592 (2003-04-01), Yamamoto
patent: 2001-007179 (2001-01-01), None
patent: 2005-39114 (2005-02-01), None
Notification of Reasons for Refusal for the Application No. 2005-119707 from Japan Patent Office mailed Mar. 17, 2009.

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