Supply mechanism for the chuck of an integrated circuit...

Details Supply mechanism for the chuck of an integrated circuit... Supply mechanism for the chuck of an integrated circuit...

2005-08-23

2010-11-09

Pham, Thanh V (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S460000, C438S464000, C257SE21327

Reexamination Certificate

active

07829383

ABSTRACT:
A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).

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