Supersonic vapor compression and heat rejection cycle

Details Supersonic vapor compression and heat rejection cycle Supersonic vapor compression and heat rejection cycle

2004-10-07

2008-07-15

Alejandro, Raymond (Department: 1795)

Chemistry: electrical current producing apparatus, product, and

With pressure equalizing means for liquid immersion operation

C429S006000, C429S006000, C165S138000

Reexamination Certificate

active

07399545

ABSTRACT:
Method and apparatus for cooling a fuel cell stack. The cooling system uses vaporization cooling of the fuel stack and supersonic vapor compression of the vaporized coolant to significantly increase the temperature and pressure of the liquid coolant flowing through a heat exchanger. By increasing the heat rejection temperature of the coolant delivered to the heat exchanger, the heat transfer area of the heat exchanger can be reduced and the mass flow rate of coolant can also be reduced. The increased fluid pressure is used to circulate the coolant through the cooling system, thereby eliminating the circulation pump associated with conventional systems.

REFERENCES:
patent: 4569635 (1986-02-01), Nicodemus
patent: 4670357 (1987-06-01), Taylor
patent: 4809523 (1989-03-01), Vandenberg
patent: 4923768 (1990-05-01), Kaneko et al.
patent: 5647221 (1997-07-01), Garris, Jr.
patent: 5776624 (1998-07-01), Neutzler
patent: 2001/0003275 (2001-06-01), Hua
patent: 2003/0039872 (2003-02-01), Grasso et al.
International Search Report for International Application No. PCT/US0321191, Filed Jul. 7, 2003.

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