Superplastic forming and diffusion bonding process

Details Superplastic forming and diffusion bonding process Superplastic forming and diffusion bonding process

2006-11-14

2006-11-14

Hong, John C. (Department: 3726)

Metal working

Method of mechanical manufacture

Shaping by direct application of fluent pressure

C228S157000

Reexamination Certificate

active

07134176

ABSTRACT:
A process of forming a structure by diffusion bonding and superplastic forming includes forming a pack from at least one skin sheet and at least one core sheet, placing the pack in a mould and heating it. A gas is injected between the skin sheet and the core sheet to urge the skin sheet against an internal face of the mould, thereby forming a cavity. Gas is also injected on the other side of the core sheet to urge it against the skin sheet, and gas pressure is maintained on said side of the core sheet thereby forming a diffusion bond between the skin sheet and the core sheet. Helium gas is used to maintain a regulated pressure of helium in the cavity between the skin sheet and the core sheet, which allows such gas trapped between the skin sheet and the core sheet to diffuse through the core sheet.

REFERENCES:
patent: 4304821 (1981-12-01), Hayase et al.
patent: 4351470 (1982-09-01), Swadling et al.
patent: 4483478 (1984-11-01), Schulz
patent: 4500033 (1985-02-01), Schulz et al.
patent: 4509671 (1985-04-01), Weisert
patent: 4811890 (1989-03-01), Dowling et al.
patent: 5994666 (1999-11-01), Buldhaupt et al.
patent: 0 502 620 (1992-02-01), None
patent: WO 02/22286 (2002-03-01), None

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