Supercritical carbon dioxide/chemical formulation for ashed...

Compositions – Etching or brightening compositions

Reexamination Certificate

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C252S079200, C252S079300, C252S079400, C438S689000, C134S001300, C215S051000

Reexamination Certificate

active

10285015

ABSTRACT:
A post-etch residue cleaning composition for cleaning ashed or unashed aluminum/SiN/Si post-etch residue from small dimensions on semiconductor substrates. The cleaning composition contains supercritical CO2(SCCO2), alcohol, fluoride source, an aluminum ion complexing agent and, optionally, corrosion inhibitor. Such cleaning composition overcomes the intrinsic deficiency of SCCO2 as a cleaning reagent, viz., the non-polar character of SCCO2 and its associated inability to solubilize species such as inorganic salts and polar organic compounds that are present in the post-etch residue and that must be removed from the semiconductor substrate for efficient cleaning. The cleaning composition enables damage-free, residue-free cleaning of substrates having ashed or unashed aluminum/SiN/Si post-etch residue thereon.

REFERENCES:
patent: 4944837 (1990-07-01), Nishikawa et al.
patent: 5868856 (1999-02-01), Douglas et al.
patent: 6149828 (2000-11-01), Vaartstra
patent: 6398875 (2002-06-01), Cotte et al.
patent: 6509141 (2003-01-01), Mullee
D. Peters, et al., Ashland Specialty Chemical Company, “Supercritical CO2Post-Etch Cleaning of a Patterned Porous Low-K Dielectric”, Electrochemical Society, 202ndmeeting, Oct. 20-25, 2002.

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