Superconformal metal deposition using derivatized substrates

Details Superconformal metal deposition using derivatized substrates Superconformal metal deposition using derivatized substrates

2003-05-23

2008-09-30

Wong, Edna (Department: 1795)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S096100, C427S097200, C427S301000, C427S304000, C427S305000

Reexamination Certificate

active

07429401

ABSTRACT:
The process of this invention involves first adsorbing a catalyst on the surface of a specimen by immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst. This two-step superconformal process produces a seam-free and void-free metal microelectronic conductor.

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