Superconductor tapes and coils and method of manufacture

Superconductor technology: apparatus – material – process – Processes of producing or treating high temperature... – Process of making wire – tape – cable – coil – or fiber

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Details

505432, 505433, 505705, 505704, H01B 1204, H01B 1300

Patent

active

055501036

ABSTRACT:
A method of producing a high temperature long length coil of superconductor wire or tape having improved critical current densities by utilizing an in-line pressing operation to heal the microcracks in the tape or wire which were introduced in rolling and coiling operations. The material can be Bismuth-2223, Bismuth 2212, Thallium-1234 or any other high temperature superconducting material. In the case of the Bismuth-2223, an improved "powder-in-tube" processing operation is provided to utilize excess bismuth, calcium, and copper in the initial composition material, and forming a partially developed Bi-2223 phase in the precursor powder introduced into the silver tubes. The final product has a 90-100% Bi-2223 phase with fine dispersions of secondary phases, to provide improved flux pinning thereby improving the critical current density of the material.

REFERENCES:
patent: 4906609 (1990-03-01), Yamauchi
patent: 5004722 (1991-04-01), Tallman
patent: 5057488 (1991-10-01), Arendt
patent: 5221663 (1993-06-01), Assmann
Haldar, Pradeep et al., "Enhancement in Critical Current Density of Bi-Pb-Sr-Ca-Cu-O Tapes by Thermomechanical Processing: Cold Rolling Versus Untaxial Pressing" Applied Physics Letters, vol. 60, No. 4, Jan. 27, 1992, pp. 495-497.
Shibuta, Nobuhiro et al. "Transport Critical Current Properties of Silver-Sheathed B. Based Superconducting Tapes and Coils at 4.2K" Japanese Journal of Applied Physics, vol. 30, N. 12B, Dec. 1991, pp. L2083-L2084.
Fukiger, R. "The Deformation of B (223) Tapes by Hot Rolling" High Temp. Superconductivity Spring Symposium, Apr. 12-16, 1993.
Halder et al, "Bulk Superconductivity at 112K in Tl(Ba,Ca).sub.2 Ca.sub.3 Cu.sub.4 O.sub.10.5+.gamma. with Four Consecutive Copper Layers", Science, vol. 241, Sep. 2, 1988, pp. 1198-1200.

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