Superconductor structure

Superconductor technology: apparatus – material – process – High temperature – per se – Having tc greater than or equal to 150 k

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505701, 505702, 505704, 421688, 421930, B32B 900

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active

052329003

ABSTRACT:
A superconductor structure having a substrate, the substrate defining a surface. Applied to the surface of the substrate is a barrier layer. Applied to the barrier layer is a layer of superconductive material comprising copper and oxygen. The barrier layer serves to prevent the interaction of the superconductive material with the substrate, thus destroying the stoichiometry of the superconductive material and resulting in a loss or decrease in superconductivity. A protective layer is, optionally, applied to the layer of superconductive material.

REFERENCES:
patent: 4253230 (1981-03-01), Davis
patent: 4499119 (1985-02-01), Smith
patent: 4585696 (1986-04-01), Dustmann et al.
Superconductivity of Serren Printed YBazCuO.sub.3 Thick Films on Y.sub.2 BaCuO.sub.5 Substrates, Jap. Journ. Appl. Physics vol. 27 No. 8 Aug. 5, 1988, pp. L1492-L1494.
Naito et al., Journal of Materials Research, vol. 2, No. 6, pp. 713-725 (Nov./Dec., 1987).
Preparation and substrate reactions of superconducting Y-Ba-Cu-O films, M. Gurvitch and A. T. Fiory, Applied Physics Letters, vol. 51, No. 13, Sep. 28, 1987.
Stability of superconducting YBa.sub.2 Cu.sub.3 O.sub.7 in the prsence of water, R. L. Barns and R. A. Laudise, Applied Physics Letters, vol. 51, No. 17, Oct. 26, 1987.
Chang, Reduced Moisture-induced degradation of Super-Films, Appl. Phys. Lett. 53(12), Sep. 19, 1988, 1113-1115.
Kitagawa, High Te Superconducting Film on Si Sub, gap J. of Appl. Phys., N27(6), Jun. 1988, 1113-1115.
Preparation of Superconducting YBa.sub.2 Cu.sub.3 O.sub.x Thin Films by Oxygen Annealing of Multilayer Metal Films, by B. Y. Tsaur et al., Appl. Physics Lett 51(11), Sep. 14, 1987.
Y-Ba-Cu-O Thin Films Prepared by a Multilayer Vacuum Method, by C. X. Qui et al., Appl. Phys. Lett., 52(7), Feb. 15, 1988.
Y-Ba-Cu-O Films Prepared by a Paint-On Method, by I. Shih et al., Appl. Phys. Lett. 52(9), Feb. 29, 1988.
Metallographic Studies of Sintered Y.sub.1 Ba.sub.2 Cu.sub.3 O.sub.7-x, by J. D. Livingston et al., Tech. Info. Series, G. E. Corp. Research & Devel., No. 87 CRD 263, Dec. 1987.

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