Superconducting YBa.sub.2 Cu.sub.3 O.sub.7-x produced at low tem

Superconductor technology: apparatus – material – process – High temperature devices – systems – apparatus – com- ponents,... – Superconductor layer next to free metal containing layer

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505126, 505450, 505500, 428469, 428471, 428930, 423593, 423604, 423635, 427 62, H01L 3912, B32B 900

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active

055277659

ABSTRACT:
A high temperature superconductor and composite structure. A superconductor is disposed on a silver substrate without interdiffusion. The superconductor is formed by heating to a temperature not exceeding the peritectic point of the superconductor material, providing an oxidizing atmosphere while not exceeding the melting point of silver and disposing the superconductor on the silver substrate.

REFERENCES:
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patent: 5227365 (1993-07-01), Van den Sype
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"Alignment of YBa.sub.2 Cu.sub.3 O.sub.7-x and Ag-YBa.sub.2 Cu.sub.3 O.sub.7-x Composites at .about. 930 C by Eutectic Formation", Zhou et al., J. of American Ceramic Society, vol. 74, No. 7, pp. 1541-1546, 1991.
"Oxide Systems", John D. Whitler, et al., Phase Diagrams for High Tc Superconductors, Compiled in the Phase Diagrams for Ceramists Data Center, National Institute of Standards and Technology, published by The American Ceramic Society, Westerville, Ohio, pp. 84-89, 1991.
"Kinetic Effects in the Preparation of YBa.sub.2 Cu.sub.3 O.sub.7-x by Solid State Reaction", Klemptner et al., presented at the American Ceramic Society, Electronic Materials Meeting, Arlington, VA, Oct. 22, 1991, pp. 1-29.
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"The Peritectic Reaction," D. H. St. John, Aeta Metall. Mater., vol. 28, No. 4, pp. 631-636, 1990.
"The Effect of Er.sub.2 BaCuO.sub.5 Additions on the Microstructure and Magnetic Properties of Zone Melt Textured YBa.sub.2 Cu.sub.3 O.sub.6+x Wires," D. Balkin et al., submitted to proceedings of 1992 Spring MRS Meeting, Apr. 1992, pp. 1-9.
"Production of Continuous Filaments of Melt-Textured YBa.sub.2 Cu.sub.3 O.sub.7-.delta. Superconductor," J. D. Hodge et al., Journal of Materials Science Letters, 10 (1991), pp. 1362-1365.
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